Metal Moves Heat Like Nothing Else
Liquid Metal cooling solutions engineered for extreme performance AI, HPC, and beyond.
About Us
Engineering thermal management for next-generation compute
Our Story
Founded on proven IP developed in the early 2000s—refined, tested, and reborn for today’s extreme compute needs. Assembled a team of pioneers in liquid metal cooling, backed by experience in commercialization, systems integration, and advanced R&D.
Why Now
AI and HPC workloads are scaling past 1,000W per chip. Water cooling is reaching thermal and efficiency limits. 3D packaging and chiplet architectures require new thermal strategies. Liquid metal provides the conductivity, stability, and scalability to keep pace with performance demands.
What Sets Us Apart
First to commercialize liquid metal cooling at scale. Modular solutions that integrate with existing infrastructure. Strong focus on reliability, safety, and long-term performance.
The Experts Behind the Thermal Revolution
Mick Wilcox – CEO
Mick combines strategic leadership with hands-on go-to-market execution. With a background in B2B growth and deep-tech commercialization, he’s led teams across multiple startup ventures and drives Molten Dynamics’ mission to market.
Andrew Miner, PhD – CTO
A thermal engineering expert with a track record of turning advanced cooling technologies into commercially viable products. Andrew leads technical execution, applying deep expertise in microelectronics thermal-fluid systems to solve the most demanding performance challenges.
Uttam Ghoshal, PhD – Advisor, Technology
A pioneer in materials science and thermal systems, Uttam brings deep expertise in liquid metal research and next-generation cooling technologies. His background in advanced R&D is instrumental in shaping our scientific direction and long-term innovation roadmap.
Key Kolle – Advisor, Operations
Key bridges technical development and practical execution. With a background in scaling hardware systems, he ensures that engineering solutions can be manufactured, deployed, and sustained in real-world environments — from prototypes to production.
Product
Developing compelling products based on a proven technology
As shown below, the team has commercialized this technology for a range of microelectronic applications. Today we are building this proven cooling technology for today’s market needs.
Applications
AI Chipmakers
Empowering Thermal-Aware
Silicon
System Integrators & Server OEMs
Optimizing Rack and
Node-Level Cooling
Hyperscale & AI Infrastructure
Delivering Cooling at
Data Center Scale
Crypto and HFT
Future-Proofing Emerging
High-Thermal Workloads
RF Power Amplifiers
Keep your GaN
Cool and Stable
Laser Diodes
Stabilize your High Power Density
Light Sources
Technology
Solving the Cooling Crisis for AI, HPC, and Beyond
Liquid metal cooling is no longer a concept—it’s a necessity. With chips surpassing 1,000W, traditional water and air-based solutions are reaching their limits. Molten Dynamics delivers scalable, drop-in liquid metal cooling loops that handle extreme heat with unmatched efficiency.
Why Liquid Metal?
| Advantage | Impact |
|---|---|
|
4.5× More Heat Removal Than Water |
Removes heat faster at higher power densities |
|
No Moving Parts |
Fewer failure points = higher reliability |
|
Sealed System |
No evaporation, no contamination, minimal maintenance |
|
Drop-In Integration |
Works with existing facility infrastructure (liquid-to-liquid handoff) |
|
Built for the Future |
Designed for the ramp to 5,000W per socket and 3D chip packaging |
How it Works
A closed-loop, three-part system that eliminates complexity and boosts performance:
- Local Metal Coolant Loop
Draws heat directly from bare die chips and accelerators - Electromagnetic Pump
Circulates metal coolant with no moving parts - Liquid-to-Liquid Heat Exchanger
Interfaces seamlessly with facility water or PG-25 for maximum compatibility
- Local Metal Coolant Loop
A Better Coolant—By Design
| Metric | Air | Water | Liquid Metal |
|---|---|---|---|
|
Thermal Conductivity |
Low |
Moderate |
50x Higher Than Water |
|
Power Density Capacity |
<300W |
~600-1000W |
The path to 5000W and beyond. |
|
Maintenance |
Moderate |
High (evaporation, contamination) |
Low (sealed loop, no evaporation) |
|
Integration Complexity |
Low |
Medium |
Low (drop-in compatible) |
|
Scalability |
Low |
Limited |
High – Future Ready |
Let's Talk About Cooling
Have a high-heat challenge? Ready to explore how liquid metal can improve performance and reduce risk? We’d love to hear from you.
Headquarters:
Austin, Texas, USA
Email:
info@moltendynamics.com