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Liquid-to-Liquid Systems

Direct to Water Heat Transfer

Data center operations teams and liquid cooling specialists tasked with supporting high density compute racks must maximize thermal dissipation while optimizing total facility energy use. While modern high density data centers feature facility water loops and coolant distribution units, traditional direct to chip water blocks encounter severe thermal resistance at the processor boundary layer as chip power scales past standard single phase capabilities.

The Thermal Challenge

Standard direct to chip water glycol loops rely on water flowing directly through cold plate microchannels. As processor power escalates, transferring heat through the fluid boundary layer requires dramatically higher water flow rates, causing steep pressure drops and requiring larger internal pumps. Attempting to manage extreme heat flux with water alone forces facilities to lower inlet water temperatures, increasing energy intensive mechanical chiller usage and driving up parasitic utility costs across the facility.

Liquid to liquid cooling diagram

The Molten Dynamics Advantage

Molten Dynamics liquid-to-liquid architectures optimize the primary heat transfer step by pairing a sealed liquid metal loop directly with a secondary facility water loop. The liquid metal primary circuit absorbs localized die heat with exceptional conductivity, rapidly transferring that energy across a specialized liquid-to-liquid heat exchanger into the facility water loop. By dramatically reducing thermal resistance at the die level, the system enables facility water to run at higher return temperatures while keeping silicon junction temperatures safe. This allows hyperscale and enterprise operators to double or triple rack density using their existing coolant distribution units without increasing chiller energy consumption.

What Direct Liquid Coupling Makes Possible

Maximum Heat Dissipation

Handle extreme heat flux at the die while maintaining standard single phase facility water loops.

Higher Inlet Water Temperature

Run facility water loops warmer to reduce or eliminate energy intensive mechanical chillers.

Lower Parasitic Pumping Work

Reduce high pressure water flow requirements by resolving thermal resistance directly at the chip.

Seamless CDU Compatibility

Couple directly with existing coolant distribution units and standard facility manifold lines.

What Are You Trying to Keep Cool?

Whether you’re designing the next generation of AI chips, building high-density compute platforms, or scaling hyperscale data center infrastructure, we’d like to hear what thermal challenges you’re working to solve.

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